Introduction
We are pleased to announce that the 6th International Symposium on Monolayer Protected Clusters (ISMPC19) will be held at Xiamen University on September 23-26, 2019. This symposium series were organized first twice in Finland (2008 & 2011) and then in the USA (2013), Japan (2015), and Switzerland (2017). We hope to bring together an outstanding group of researchers to discuss the latest developments in the field of monolayer protected metal clusters and nanoparticles.
Location：Xiamen University， Xiamen， China
Date：September 23-26, 2019
Organizers：College of Chemistry and Chemical Engineering, Xiamen University
Collaborative Innovation Center of Chemistry for Energy Materials
Chairman：Prof. Nanfeng Zheng
Invited Speakers(Confirmed)
Boon Teo(University of Illinois, US)
Rongchao Jin(Carnegie Mellon University, US)
Christine Aikens(Kansas State University, US)
De-en Jiang(University of California, Riverside, US)
Ken Knappenberger(The Pennsylvania State University, US)
Stefan Knoppe(Universität Stuttgart, DE)
Tatsuya Tsukuda（University of Tokyo, JP）
Yuichi Negishi(Tokyo University of Science, JP)
Katsuaki Konishi(Hokkaido University, JP)
Jianping Xie (National University of Singapore, Singapore)
Hannu Hakkinen(University of Jyvaskyla, FI)
Ackerson Christopher(Colorado State University, US)
Maia Azubel (Stanford University, US)
Terry Bigioni(University of Toledo, US)
Peng Zhang(Dalhousie University, CA)
Osman M. Bakr(KAUST, SA)
Thomas Bürgi(University of Geneva, CH)
Important Dates
Opening date for registration/abstract submission: 15 March 2019
Deadline for abstract submission: 1 September 2019
Accepted abstract notification to author: 3 September 2019
End of early registration: 1 August 2019
Registration deadline: 10 September 2019
Conference begins: 23 September 2019
Previous Conferences
ISMPC17 https://www.prochimia.com/news/4
ISMPC15 https://www.rs.tus.ac.jp/ismpc15/
ISMPC13 https://sites.chem.colostate.edu/ackersonlab/ismpc13/ismpc13.html
Contact
Jie Chen chen_jie@xmu.edu.cn
Xiting Yuan 249526269@qq.com
